SEOUL At the Sedex Korea 2005 trade show here, South Korean semiconductor-equipment provider Doosan DND Co. Ltd. rolled out an advanced chemical mechanical polishing (CMP) machine for 300-mm wafer applications.
Doosan (Kyunggi-Do) claims to have its first customer for the tool: Samsung Electronics Co. Ltd., according to sources. Samsung also uses Doosan’s 200-mm CMP tools.
The chip giant also has a large installed base of 200- and 300-mm CMP tools from Applied Materials Inc.
Doosan’s tool, dubbed the Unipla 341, is said to deploy non-contact cleaning technology within five separate modules within the unit. The first module supports CMP while the others are cleaning stations.
The tool provides high flexibility for every point of unit. Up to two slurries/chemicals are used for every point of unit.
It consists of in-line metrology modules from Nova and Nanometrics. It features 3 or 4 axis robots for wafer handling and 6 loading and unloading devices.