LONDON Nextreme Thermal Solutions Inc., a developer of thin-film superlattice thermoelectric material and on-chip thermoelectric devices, has made a strategic investment agreement with In-Q-Tel, a venture group funded by CIA and the U.S. intelligence community.
Nextreme (Research Triangle Park, NC), which announced an $8 million Series A round of financing in February 2005, did not reveal the amount of money it had or was set to receive from In-Q-Tel.
The technology is based on a superlattice thermoelectric material of bismuth telluride, which Nextreme has been working on since 1993. Embedded thermoelectric components (eTECs) can be used to cool hotspots on both semiconductor and optoelectronic integrated circuits. They can also be used to control the temperature of temperature-sensitive components, such as photonics, DNA chips, and asynchronous logic circuits. The same devices can also be used as power generators, scavenging waste heat and converting into electricity. Nextreme said.
“This agreement will help provide a new channel into the intelligence community and government programs at large, which could lead to new applications for Nextreme's technology,” said Jesko von Windheim, chief executive officer of Nextreme, in a statement.
“We invested in Nextreme because its advances in the field of thermal management promise significant impact in a wide variety of both commercial and intelligence-related markets,” said William Johnson, a principal at In-Q-Tel, in the same statement.
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