TOKYO The International Sematech Manufacturing Institute (ISMI), a subsidiary of Sematech, has agreed to pursue 300-mm productivity improvements as a bridge to 450-mm implementation.
The agreement was reached at advisory committee meeing held in Kyoto on Wednesday (March 29).
ISMI launched a 450-mm wafer program in January to prepare for next-generation wafer implementation expected in 2012, according to the International Technology Roadmap for Semiconductors (ITRS).
The 300-mm 'prime' strategy was included as a part of the program to improve current 300-mm fab productivity to enable high-mix, high-volume production. It also aims to extend the life of present 300-mm wafer infrastructure.
During this week's committee meeting, three months after the launch of the 450-mm wafer program, members reviewed the program and agreed to position the 300-mm Prime effort as a transition technology to 450-mm implementation. The target of the 300-mm Prime program is to minimize the number of design and fab architecture changes required for 450-mm wafer implementation.
A key concern for 450-mm wafer implementation is the availability of materials such as silicon ingots, said ISMI Director Scott Kramer. To involve wafer manufacturers, ISMI will meet again next week in Munich, Germany, at Semicon Europe.
Currenlty, Matsushita is the only member of ISMI from Japan, but other Japanese companies are considering joining, according to Kramer.