BANGALORE, India Despite the existence of several heat dissipation technologies, the need still persists for an economical thermal management technology, according to a report by market research firm Frost and Sullivan.
Although a number of software solutions are available which make thermal design easier, the industry is still waiting for a solution that will help achieve optimization of IC in a shorter time, according to the report.
"The use of computational fluid dynamics software for thermal modeling reduces the complexities a little, but the optimization process is still a long-drawn-out process. It has to be improved considerably if thermal management is to become more efficient in ICs," the study said.
Miniaturization of ICs has given rise to the need for sophisticated thermal management with greater miniaturization bringing about higher quantity of heat dissipation. With heatsinks helping to extend the life of ICs, there has been significant research in thermal management, but the industry is still awaiting an optimal solution.
"Heatsinks made of highly conductive metals such as copper and aluminum offer low-cost solutions to low thermal density issues. Such sinks are also suited for high-volume production and slashing costs at the device assembly level. Composite materials such as aluminum-silicon carbide for thermal applications also bring down machining costs, and hence overall expenses," said Vijay Shankar Murthy, a research analyst at the firm.
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