SAN JOSE, Calif. Toshiba Corp. Wednesday (May 31) said that it plans to build a 200-mm wafer fab at a cost of over 50 billion yen ($450 million), according to Reuters.
The plant is designed to make power semiconductors. The plant, to be located in Japan's Ishikawa prefecture, is scheduled to break ground in September. Production is slated for the third quarter of calendar 2007.
The fab has a total capacity of 60,000 wafers a month, which is aimed for 2011.