SAN FRANCISCO Privately held EDA vendor ViASIC Inc. Friday (June 30) introduced DuoMask, billed as a high-density, two-layer standard-metal fabric for building configurable system-on-chip (SoC) devices.
According to ViASIC (Research Triangle Park, N.C.), DuoMask enables designers to use configurable logic to add or change SoC features, fix bugs and design different versions of the same system for different markets.
For seven metal processes, DuoMask uses via layers 2 and 4 to program the pre-built and pre-characterized logic and routing, ViASIC said. The configurable logic is built upon existing technologies providing an accurate, proven fabric almost immediately for any process, according to the company. The new configurable logic libraries require no logic cell layout, timing or power characterization, ViASIC said, instead relying on existing libraries.
ViASIC claims that DuoMask is the densest standard-metal fabric available, with 150 gates per square millimeter at 90-nanometer.
"DuoMask provides affordable, two-mask customization for every digital process," said Bill Cox, ViASIC's chief technology officer, in a statement. "We are excited to provide this new technology which supports virtually anyone, in any process, at any fab and best of all it relies on existing proven and characterized libraries."
DuoMask is immediately available for all digital processes between 0.35 micron and 45 nm, ViASIC said. U.S. pricing starts at $95,000, the company said.
DuoMask, along with ViASIC's one-mask library, ViaMask, and ViaPath, a place-and-route tool for standard metal, will be demonstrated at the Design Automation Conference here next month, according to the company.