SAN FRANCISCO Design-for-manufacturability (DFM) lithography simulation vendor Brion Technologies Inc. Thursday (Sept. 14) introduced Tachyon M3D, promising more accurate optical proximity correction (OPC) implementation and verification by incorporating mask three-dimensional imaging effects.
According to Brion (Santa Clara, Calif.), Tachyon M3D constructs image-based photomask imaging models through electromagnetic field simulation of the light passing through the three-dimensional mask feature topography on a reticle. For high-speed, full-chip computational lithography, Tachyon M3D replaces the mask approximation with its image-based mask three-dimensional models, then computes and combines wafer image intensities from different source polarizations, before resist and etch computations, the company said.
"Our customers have asked us to incorporate mask 3-D effects into our computational lithography products," said Eric Chen, Brion CEO. "We're introducing Tachyon M3D to help IC manufacturers achieve the accurate OPC and OPC verification they need for their advanced development fabs."
Brion said Tachyon M3D's capabilities are also important when applied to through-focus lithography modeling because of the mask 3-D effects that can occur across the full range of focus variation during the manufacturing process. Since focus variation is inevitable, these capabilities are important to OPC implementation and verification of leading-edge chip designs, according to the company.
Tachyon M3D is available now. Brion said it has already been evaluated by unnamed semiconductor manufacturers.
Brion plans to hold a Tachyon M3D customer training session at the Bacus photomask technology conference in Monterey, Calif. on Sept. 18.