SAN JOSE, Calif. Seeking to reduce the problematic heat issues in data centers, embedded systems and other environments, IBM Corp. Tuesday (Oct. 3) rolled out low-power versions of its RISC-based microprocessor line and intellectual-property (IP) processor cores.
The two PowerPC processors and ASIC hard cores are manufactured using IBM's 90-nm process, equipped with copper interconnects and silicon-on-insulator (SOI) technology.
"Innovation in microprocessors is no longer about simply raising the bar on speed," said Ron Martino, director of Power Architecture Solutions at IBM's Technology Collaboration Solutions unit, in a statement. "IBM is committed to the development of high-performance, energy-efficient processors for a wide range of enterprise and consumer applications."
IBM introduced two new standard PowerPC single-core processors. The PowerPC 750CL, a 32-bit microprocessor, consumes half the energy as its predecessor, and performs at speeds ranging from 400-MHz to 1-GHz. The 750CL includes a 256-KB L2 cache, and is targeted at networking, storage, imaging, consumer electronic and other high-performance embedded applications.
The new PowerPC 970GX supports both 32- and 64-bit operations. The range of frequencies for the 970GX is from 1.2- to 2.5-GHz, enabling the chip to support high-bandwidth data processing and algorithmic intensive computations.
IBM also introduced the CPC965, a companion chip to the 970 series of processors designed to provide I/O connectivity and run at less power than comparative bridge chips. Samples will begin to ship in March 2007.
IBM also announced three new 32-bit processor cores. The 460S synthesizable product will allow designers to select the L1 and L2 cache size and processor local bus (PLB) version necessary for implementing a single or cache coherent multi-processor design.
The new 464FP H90 has an integrated double precision floating point unit. Meanwhile, the 464 H90 hard core is expected to dissipate slightly more than half (530mW) a Watt at 1-GHz performance.
The new processors are now available. The 464 H90 hard core preliminary design kit is targeted for availability at the end of the year, while the 464FP H90 preliminary design kit targeted in first quarter 2007. The planned availability of the 460S is first quarter 2007.