SINGAPORE Assembly and test services provider Amkor Technology began operations at a new 300-mm wafer bump factory here on Monday (Oct. 16).
Amkor said in a statement that the new facility would have an initial capacity of 8,000 wafers per month, rising to 30,000 wafers per month.
Combined with Amkor's existing probe and test plant in Singapore, the bumping operation will among other things offer Chartered Semiconductor a suite of bump, probe and test services for advanced flip chip applications, the statement said.
The factory will employ the same processes as Amkor's Taiwan bumping business and will also use Common Platform-based silicon at the 90- and 65-nm nodes. Amkor began qualifying Common Platform technology for IBM, Chartered and Samsung in September.
Oleg Khaykin, Amkor's executive vice president and chief operating officer, said the new facility would focus on flip-chip packaging for advanced silicon. He said near-term production will be "largely supported by long-term supply agreements for both bump and probe services."