SAN DIEGO At the annual Design Automation Conference (DAC) here, IBM Corp. has rolled out an ASIC based on a 45-nm process, as well as silicon-on-insulator (SOI) and embedded DRAM technologies.
IBM's product, dubbed the Cu-45 High Performance Custom Chip (ASIC), can improve processor memory performance in about one-third the space with one-fifth the standby power of conventional SRAM, according to IBM.
Also being announced are three additional digital and analog IBM semiconductor processes. The first one, dubbed the SiGe BiCMOS 5PAe, is a silicon germanium-based analog offering. It is the first IBM process based on its through-silicon via technology. Applications include power amplifiers for cell phones, wireless phones and WLAN/WiMAX applications.
The second process, dubbed the CMOS 11LP, is optimized for lower device leakage for handset design. Finally, the SiGe BiCMOS 6WL technology, is a cost-optimized version of existing SiGe technology.