SAN JOSE, Calif. -- Amid a DRAM downturn and losses, Qimonda AG has revamped its 200-mm manufacturing strategy. The DRAM maker also plans to end 200-mm production with two foundry partners: Semiconductor Manufacturing International Corp. (SMIC) and Winbond Electronics Corp.
Germany's Qimonda (Munich) will discontinue its contract manufacturing deal for 200-mm wafers from its former parent, Infineon Technologies AG.
The move follows losses and a major DRAM downturn. Overall, Qimonda plans to focus its production on 300-mm capacities, reducing its 200-mm manufacturing worldwide. With this move, the share of 300-mm capacity will increase to approximately 90 percent by the end of the current financial year.
But the company is taking painful steps to reach those goals. With its fabs in Richmond, Virgina, the number of 200-mm wafer starts will be reduced by approximately 15 percent, ''in the context of switching capacities from 110-nm to 80-nm technology, according to the company. ''The remaining 200-mm capacity will continued to be used for manufacturing legacy products.''
At its Dresden site in Germany, Qimonda will discontinue the contract manufacturing of 200-mm products by Infineon Dresden. The last wafers for Qimonda will enter production at the end of February 2008.
Qimonda's activities in Dresden will be its 300-mm manufacturing and R&D. Infineon in Dresden will focus on logic for various applications such as automotive, communications or security, positioning the site as a competence center for chips sizes from 250- to 90-nm.
The contract manufacturing of 200-mm capacity by Qimonda partners Winbond of Taiwan and SMIC of China are already or will be discontinued at the end of 2007.
The contract manufacturing of 200mm capacity by Qimonda partners Winbond and SMIC in Asia are already or will be discontinued at the end of 2007.