This week, the company has rolled out its first products for use in making logic, memory and other devices. To gain share, AMEC claims it won't bomb the prices in the marketplace. "We want to get market share not by cutting prices," Yin said.
Instead, AMEC claims to have the technology that can compete with the fab-tool giants. The company's etcher, for example, has a CD control between 3-to-5-nm. Most of the competitive tools are struggling to go below 5-nm, according to Yin.
"A lot of companies are struggling to get to 3-nm, which is very challenging," he said. At the 32-nm node, the CD control requirements could go down to 2-nm, he added.
The company has two tool lines. AMEC's Primo D-RIE is a decoupled reactive ion etch system for use in critical and other dielectric etch applications. The company's Primo HPCVD system is aimed for shallow trench isolation (STI) and pre-metal dielectric deposition.
At the heart of each tool is a mini-batch cluster architecture, said to improve productivity by more than 35 percent over comparative systems, while offering a 35 percent lower cost-of-ownership benefit.
The 300-mm Primo D-RIE system leverages a twin-station mini-batch cluster system with a single-wafer environment. The mini-batch cluster is said to have up to six single-wafer process stations. An endpoint control per station feature enables each wafer to run in a single chamber environment.
It features a decoupled and dual-frequency RIE plasma source. Direct resistive top electrode heating with a close-loop control enables precise and fast temperature control for consistent wafer processing, according to the company.
The tool is aimed for 65- and 45-nm chip designs and beyond. Applications include hard mask open, spacer, dual damascene via and trench etches, among many others.
Meanwhile, the 300-mm Primo HPCVD system is also based on a mini-batch cluster architecture and a patented multi-channel distribution technology. The mini-batch cluster is said to have up to 12 single-wafer processing stations.