SAN JOSE, Calif. -- The sparks are expected to fly at the upcoming Semicon West trade show in San Francisco, as the industry is expected to debate 450-mm fabs, 3-D packaging and other hot topics.
The Semicon West programs and events run from July 14-18. The show organizer, the Semiconductor Equipment and Materials International (SEMI) trade group, is also launching a new and major event in the exploding solar market.
SEMI and Intersolar, Europe's largest solar energy industry event, will launch Intersolar North America at Semicon West. This exhibition and conference includes all segments of the solar energy industry, including cell and module manufacturers, equipment vendors and others.
Another major event is the so-called Packaging Summit, which takes place on July 15, said Tom Morrow, vice president of global exhibitions and marketing at San Jose-based SEMI. This event features a discussion on a 3-D technology called through-silicon-via (TSV), he said.
The sparks are expected to fly at another event, entitled: "The 450-mm Transition: When Will It Make Economic Sense for the Semiconductor Industry Ecosystem?"
Intel, Samsung and TSMC are pushing for 450-mm fabs. The event will present the opposing or "alternative viewpoint," Morrow said. Slated for July 17, a panel on 450-mm includes representatives from Applied, ASML, Axcelis and Lam, he said.