SAN FRANCISO NEC Electronics Corp. will increase production capacity at its fab in Roseville, Calif., adding a 0.15-micron process to the facility's 8-inch wafer line, according to a statement issued Monday (Oct. 6) by the Japanese company's U.S. subsidiary.
Installation of additional equipment for the 0.15-micron process will roughly double capacity of the 8-inch line, which was added in 2007, NEC said. The 8-inch line has been in production since April and is expected to reach full production in March 2009, the company said.
NEC said in 2006 that it planned to add 0.15-micron capacity on 8-inch wafers in Roseville. Last year the company announced plans to shut down several manufacturing lines in Japan and exit the structured ASIC and single-chip cell phone sectors.
Expansion of the Roseville fab makes it possible for customers to leverage it through NEC's Multifab manufacturing program, which enables customers to qualify multiple manufacturing and assembly/test facilities for a single design platform, according to NEC.
Fabrication on NEC's 6-inch production lines in Roseville, which use 0.35- and 0.25-micron processes, will continue based on customer needs, NEC said.