SAN JOSE, Calif. -- More speculation is flying about a planned news conference Monday (March 2), where Intel Corp. and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) are set to make a strategic announcement.
''According to our checks, Taiwan Semi will initially provide Intel contract manufacturing using its 200-mm capacity,'' according to a report from FBR. ''Additionally, we do not rule out Taiwan Semi manufacturing complex
system-on-a-chip (SoC) products such as Atom (with wireless communication application) that require such advanced technology nodes as 45-nm.''
Intel and TSMC are no strangers to each other. TSMC has made chipsets and other products for Intel on a foundry basis.
''Although Taiwan Semi has in the past manufactured NOR Flash for Intel (with Intel accounting for less than 5 percent of Taiwan Semi's total revenue), we expect the new partnership to span to a wide range of logic products used in the communication products with a
significant volume thus dramatically increasing Intel's mix of revenues at Taiwan Semi,'' according to the report.
''We note that Intel recently announced the closure of five 200-mm fabs, located in the Philippines, Malaysia,
Oregon, and Santa Clara, California,'' the report said. ''Looking ahead, we expect Intel to focus solely on 300-mm capacity at 45-/32-nm technology nodes.''