LONDON Research group IMEC and Terepac Corp. (Waterloo, Canada) are joining forces to develop a wireless ECG system within the Human++ Program at IMEC's Holst Centre in Eindhoven, the Netherlands.
The project is expected to be the first collaborative venture in a number to be undertaken between the partners into medical electronics systems.
Terepac specializes in miniature packaging and assembly and, the partners suggest, for many applications, like on-the-body devices, thin and flexible form factors will greatly improve the comfort of the wearer. In order to allow large-scale manufacturing and market penetration, low-cost yet high value solutions are key, they add.
With Terepac's patented photochemical printing process, the companies say, thinned silicon dies and passive components can be placed on flexible substrates at speeds of more than one chip per second
and with accuracies down to a few microns.
The wireless ECG patch that is being developed will be
used as a test vehicle for further development of Terepac's technology.
For IMEC it is an opportunity to go from a lab-scale assembly on polyimide carrier to a more production-ready version of its wireless sensor nodes.
First results are expected by mid 2010.
Julien Penders, Program Manager Body Area Networks at IMEC/Holst Centre said initial contacts with Terepac were laid a few months ago. "It quickly became clear that their expertise would be a valuable addition to the existing competences that we and our partners have on board. We look forward to further developing our sensor technology and opening doors towards low-cost and large-scale manufacturing for our existing partners
or companies interested in this technology."
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