SAN JOSE, Calif. -- Japan's Elpida Memory Inc. has struck again.
The company and Taiwan's Winbond Electronics Corp. announced that they have signed a memorandum of understanding (MOU) for DRAM foundry services. Winbond will manufacture DRAMs under contract to Elpida.
The agreement pertains to the supply of GDDR3 and GDDR5 graphic DRAMs for Elpida. Prior to this agreement Winbond and Elpida have been working together to commercialize GDDR3 and GDDR5 DRAM products.
Winbond is preparing to begin commercial production of these products by the end of 2009 while Elpida plans to begin purchasing the output in the first half of 2010.
In addition, Elpida (Tokyo) and Taiwan's ProMOS Technologies Corp. recently announced the signing of a DRAM foundry agreement.
For some time, Elpida has also outsourced DRAM production at Taiwan's Rexchip Electronics Corp. Last month, Elpida increased its stake in Rexchip from 52 percent to 64 percent. The remaining shares are owned by Taiwan's Powerchip Semiconductor Corp.