PORTLAND, Ore. Omron Electronic Components has begun manufacturing a piezo-resistive MEMS chip for blood pressure monitoring with five times more pressure sensor dies on each 8-inch wafer.
Yoshio Sekiguchi, senior general manager of Omron's Micro Devices Division (Schaumburg, Ill.) said the company will release excess capacity on its new 8-inch wafer line in Japan to make its piezo-resistive pressure sensors. Omron began manufacturing capacitive MEMS sensors used in its blood pressure monitors in 1996. Its new MEMS pressure sensor is not only manufactured on bigger wafers, but also has a smaller die size,
When offered to OEMs in 2010, the new pressure sensor will be integrated into a wider variety of applications beyond medical, including leak detection, industrial controls, environmental controls, pressure indicators and for home appliances such as vacuum cleaners.
Omron claims its new piezo-resistive MEMS pressure sensor offers ultra-low offset voltage and span dispersions that eliminate the need for trimming, low power consumption of 0.2mW and wider temperature tolerance and linearity. Omron also is working on a monolithic piezoelectric MEMS pressure sensor which integrates signal amplification circuitry onto the same die.