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Intel still searching for 3-D chip app

12/10/2009 08:00 PM EST
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routing_algorithm
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re: Intel still searching for 3-D chip app
routing_algorithm   5/26/2010 9:43:35 AM
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By themselves TSVs will be a test problem.

GeniusEE
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re: Intel still searching for 3-D chip app
GeniusEE   12/15/2009 8:15:17 AM
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TSVs are fairly parasitic in themselves, so don't kid yourself that they are a panacea. With the thermal issues associated with chip stacks, you're not going to be able to design as fast of an buffer amp for that I/O, possibly precluding any gains you propose. What TSV does offer is interconnect density, I/O per sq mm, though it displaces a dense circuit element, which is RAM. Again, the benefit is questionable due to the high number of bits displaced. As the article pretty much states: a technology looking for a problem to solve and hasn't found one yet.

Nirav Desai
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re: Intel still searching for 3-D chip app
Nirav Desai   12/14/2009 12:33:36 PM
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As TSVs reduce the interconnect lengths by as much as factors of 1000, the lower parasitics will support much higher data rates. The main area where they can be used is high speed chip to chip interconnects where the only feasible technology right now is power hungry and expensive optical interconnects.

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