LONDON Wireless technology company Qualcomm Inc. (San Diego, Calif.) has said it working with Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) on 28-nm process technology and that it intends to move directly to the advanced process. Tape-outs on the 28-nm node are expected in mid-2010.
Having just announced that it is expanding its foundry roster with GlobalFoundries Inc. (Sunnyvale, Calif.), the lastest announcement demonstrates Qualcomm's continuing relationship with the world's largest foundry supplier of chips.
Qualcomm stressed the importance of being at the leading-edge in process technology for reduced size and power consumption for its ARM-based Snapdragon chipset. "The two companies are capitalizing on their long-term relationship as Qualcomm works on migrating directly from the 45-nm to the 28-nm node," Qualcomm said in a statement.
Qualcomm and TSMC worked together on the 65- and 45-nm manufacturing process technologies. They are continuing their relationship into low-power, low-leakage 28-nm designs for high-volume manufacturing. Qualcomm and TSMC are working on both high-k metal gate (HKMG) 28HP and silicon oxynitride (SiON) 28LP technologies. Qualcomm said it expects to tape out its first commercial 28-nm products in mid-2010.
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