SAN JOSE, Calif.--Tessera Technologies Inc. has signed a technology licensing agreement with Nanium S.A.
Nanium, formerly known as Qimonda Portugal, previously was the largest semiconductor packaging assembly and test operation within Qimonda.
Under the agreement, Nanium has licensed Tessera's semiconductor packaging technology covering a broad range of chip scale, multi chip and flip chip package types. The initial term of the license agreement runs through the end of 2017.
"Having access to Tessera's packaging technologies will allow us to grow and serve customers in the DRAM market and throughout the semiconductor industry," said Armando Tavares, Nanium's president of the Executive Board, in a statement.