LONDON Infineon Technologies AG and Fairchild Semiconductor International Inc. have announced an agreement to create compatibility between their power MOSFET packages. Specifically the agreement covers the Infineon PowerStage 3x3 and Fairchild MLP 3x3 packages.
The compatibility agreement is in response to the need for supply security while balancing the drive towards best-in-class efficiency and thermal performance in DC-DC conversion. It takes advantage of the expertise both companies offer for asymmetric, dual and single MOSFETs for DC-DC applications from 3 to 20 amps.
"Standardizing power packages benefits our customers as we minimize the amount of unique packages available in the market place, while offering solutions that enhance performance levels in smaller form factors than the previous generations," said Richard Kuncic, director and product line manager for low voltage MOSFETs at Infineon Technologies, in a statement.
"Fairchild and Infineon have standardized the pin-out and have complementary performance levels, offering customers two sources for their high efficiency design needs in the computing, telecom and server markets," said John Bendel, Fairchild's senior vice president of low voltage products, in the same statement.
The companies did not state which package or packages had been altered to achieve the compatibility.
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