LONDON -- Flomerics Ltd., a provider of thermal and EMC simulation software for electronics systems, is planning to show visitors to the DATE exhibition an EDA tool that combines both types of simulation in a single piece of software.
The tool is due to be labeled as version 4.1 of the company's Flotherm EDA tool.
Flotherm provides three-dimensional simulation of thermal effects within enclosures, on circuit boards and chip packages. It is based on computational fluid dynamics and finite element analysis, with the accuracy of simulation being dependent material modeling and grid resolution.
To date Flo/EMC has been a separate electromagnetic tool for analyzing electronic system enclosures and cabinets, including the effects of cables, seams and apertures. Flo/EMC utilizes the Transmission Line Matrix (TLM) method for solving Maxwell's equations, according to Flomerics.
One advantage claimed for the new software is that it prevents designers being "bounced" around the design space a potential problem with iterative design, although it remains to be seen how the upgraded Flotherm optimizes both analyses.