REHOVOTH, Israel--Nova Measuring Instruments Ltd. today announced a joint development pact with Applied Materials Inc. to integrate metrology capability in copper CMP wafer polishing tools.
Applied will use Nova's metrology systems in 200- and 300-mm wafer chemical mechanical planarization (CMP) systems to measure erosion and dishing phenomena on substrate surfaces and to detect remaining copper and barrier residues on wafers. The NovaScan's metrology capabilities were developed in conjunction with Applied Materials and several leading IC manufacturers, said the Israeli company.
The project also underscores the "importance of integrated metrology for the copper CMP process," said Gabi Seligsohn, vice president strategic business development at Nova. Terms of the joint-development and integration agreement were not released.