SAN JOSE -- Fujitsu Microelectronics America Inc. today said it was offering the industry's first four-stacked multi-chip package, which is designed to hold a pair of 64-megabit NOR-based flash memory devices, a 32-Mbit Fast Cycle RAM (FCRAM), and an 8-Mbit SRAM. The product offers the highest memory capacity available today for mobile systems designs, according to Fujitsu.
The new multi-chip package (MCP), called the MB84VZ064A, combines the memory used in two existing MCP products in a single four-chip stacked version, Fujitsu said. The new package is a 103-ball (10.0-by-9.0-by-1.4-mm) plastic ball-grid array. Stacking four chips in the new MCP results in an area reduction of about 63% compared to previous packages, according to the company.
Fujitsu's U.S.-based chip operation also introduced a couple of new two-stacked multi-chip packages for FCRAMs (16-, 32- and 64-Mbit devices), providing mobile systems developers with fast cycle memory in a 9-by-9-mm package. Samples of the new stacked packages are available now and volume production will start in the second quarter of 2002.
The two- and four-stacked packages help mobile systems designers get around the problem of reworking board layouts when additional memory is required for new features, said Fujitsu.
The two 64-Mbit NOR-type dual-operation flash memories are used for program and data storage. These flash memories are fabricated in a 0.17-micron process technology and run faster than previous NOR-based flash chips--access speeds are 70 ns vs. 80 ns, Fujitsu said. Second-generation FCRAM chips use an operating current of only 25 mA and achieves access speeds of 70 ns, said the company.
In 100-unit quantities, the four-stacked MCP prices start at $60, while the two-stacked package products start at $26 each.