CHANDLER, Ariz. -- Microchip Technology Inc. today announced it has extended the use of a tiny 8-lead micro small outline package (MSOP) for use in serial EEPROMs with densities of 32- and 64 kilobits.
The 8-lead MSOP package has a footprint of 14.7 mm2, including contacts, which Microchip said is 50% smaller than 8-lead SOIC (small outline IC) packages and 23% less than 8-lead TSSOPs (thin shrink small outline packages). Until now, the 8-lead MSOP was previously reserved for 128-bit through 16-Kbit EEPROMs, but the new series places higher-density electrically-erasable PROM in the same package footprint, Microchip said.
The MSOP package has a height of 1.1 mm, which is 29% lower than the profile than the SOIC package, said the company.
The miniaturized versions of Microchip's 32-Kbit 24LC32A and 64-Kbit 24LC64 EEPROM series extend the company's 8-lead MSOP package offering from 128 bits to 64 Kbits. The small-footprint EEPROMs are aimed at portable and handheld systems as well as automotive electronics. The EEPROMs have an operating voltage as low as 2.5 V and active current of 1 milliamps and standby current of 1 microamps. In battery applications, the EEPROMs can run from 1.8 V.
"With the tiny, 8-lead package offering, these new devices set a new standard for space efficiency and usefulness, especially for our customers in the wireless and hand-held arena," said Alex Martinez, product marketing manager in the Memory Product Division at Microchip.
In quantities of 10,000, the 24LC32A and the 24LC64 devices are prices at $0.42 and $0.49 each, respectively. Samples and volume production shipments are available now.