TOKYO -- Toshiba Corp. today said it is offering the industry's smallest multi-chip package for stacked memory in portable phones. The four-chip NOR flash/SRAM memory products measure 10-mm long and 7-mm wide, combining 8 megabits of static RAM and 32 Mbits of pseudo SRAM with two 64 Mbits of nonvolatile flash memories.
Toshiba said the new stacked memory package reduces board-space requirements by 30% compared to the company's existing 9-by-12-mm multi-chip package.
"Since conventional SRAM and NOR flash solutions are, in many cases, both cost and board-space prohibitive for some mobile applications, there is a definite industry need for the MCP devices we are introducing," said Paul Liu, business development manager for communications memory products for Toshiba America Electronic Components Inc. in Irvine, Calif.
Toshiba said it is the only supplier of multi-chip packages that produces its own SRAM, pseudo SRAM, NOR flash and NAND flash devices. The company plans to leverage its collection of memories to serve a range of portable systems applications, including 2.5 and 3G cell phones. Toshiba said it will soon incorporate NAND flash memories in new multi-chip packages (MCP).
Samples of the four-chip MCP devices are priced at $70 each and scheduled to become available next month. Full production is set to start in May.