MINNEAPOLIS -- PPT Vision Inc. here and San Jose-based Electroglas Inc. today announced a partnership to develop high-speed inspection systems for semiconductor manufacturing using three-dimensional scanning technology.
The partnership will integrate a custom version of PTT Vision's SpeedScan sensor into Electroglas' QuickSilver 2-D and 3-D inspection systems.
The integration of PPT Vision's high-speed SMI (Scanning Moir Interferometry) 3-D scanning technology with QuickSilver tools "will significantly enhance our ability to meet the semiconductor industry's growing throughput requirements for 3-D bump wafer inspection," said Jeff Hintzke, vice president and general manager of Electroglas' Inspection Products Division.
"This enhanced technical capability combined with our integrated process management software will help make our inspection systems the most efficient, intelligent solutions available," Hintzke added.
The first phase of the partnership will focus on funded product development, with production shipments of 3-D inspection systems expected within 12 months, said the two companies. The terms of the development partnership were not released.