PHOENIX -- Austria's SEZ Group here today officially opened its first U.S. laboratory for development and testing of 300-mm wafer cleaning processes. The 3,000-square-foot lab is currently running three-to-four demos per week, said SEZ.
The Phoenix facility is primarily testing customer wafers for stress relief, polymer removal and wafer thinning. Additional capabilities include backside film removal for pre-litho yield enhancement, backside and bevel clean for copper decontamination and frontside polymer clean for metal line, via holes and copper dual-damascene interconnect technologies, said SEZ, which is based in Villach, Austria.
"300-mm is here, and the ability to provide complete 300-mm testing capability is still a rarity," declared Jim Mello, vice president of operations at SEZ America. "This lab will give our customers and technology partners an edge in turn-around time, with more valuable and timely data, and will greatly speed customers' development and introduction of faster, more powerful chips," he predicted.
SEZ said its U.S. lab has complete 300-mm capability, including 1,253 square feet of class 10 cleanroom space with 20 pieces of process equipment. The company installed its spin-processors for wafer cleaning steps in May. The facility also has an Axcelis 200ES asher tool and metrology equipment from KLA-Tencor, FEI, Philips, ADE, Nikon, Luxtron, Rigaku, Veeco, and CDE RESMAP.
The KLA-Tencor SP1 metrology tool is capable of detecting less than 60-nm light point defects on non-patterned 200-mm (8-inch) and 300-mm (12-inch) diameter wafers. The 300-mm tools include FEI Co.'s Expedia dual-beam single-wafer SEM/FIB (scanning electron microscope/ focused-ion beam) with FOUP (front opening unified pod) interface and Philips Analytical's PZ2000-300 dual-wavelength ellipsometer.