MOUNTAIN VIEW, Calif. -- In a move to expand its chip-manufacturing portfolio, silicon foundry startup Dongbu Electronics Co. Ltd. plans to enter the wireless space by offering a radio-frequency (RF) process technology, according to company officials.
Dongbu plans to offer a 0.18-micron, RF-based foundry process by year's end for customers, said Peter Hillen, executive vice president of business development for the company. Dongbu is based in Eumsung, South Korea.
"It's a logical step for us," Hillen said. "We view ourselves in having expertise in mixed-signal technology," he told SBN on Thursday.
The company will provide more details about its RF process later this year, but noted that it is looking to expand its foundry capabilities.
At present, Dongbu mainly focuses on CMOS-based chip production. The company has an 8-inch fab in Korea, which is processing 0.25- to 0.18-micron CMOS wafers right now. It offers two technologies, including a process licensed from Japan's Toshiba Corp. Dougbu also offers what the company calls a "foundry-compatible" process as well.
Earlier this year, the company said it plans to develop a 0.13-micron process by the third quarter of 2002 (see Feb. 6 story ).
And like other foundry providers, Dongbu is seeing a growing demand for its services in the marketplace right now. "There's a lot more activity right now," Hillen said.
The company plans to expand its fab capacity to 20,000 wafers a month by year's end. In total, its fab is capable of making 40,000 wafers a month.