AUSTIN, Tex. -- Advanced Micro Devices Inc. today said its 200-mm wafer Fab 25 here is now ramping volume production of 32- and 64-megabit flash chip, using a 0.17-micron process technology, after beginning a transition from microprocessor production to nonvolatile memories.
The conversion from processor to flash production is nearly completed with the last MPU expected to be fabricated by Fab 25 in the third quarter this year, said AMD.
The Fab 25 plant is now being equipped with tools and processes for volume production of 0.13-micron flash memories. AMD plans to start running the new process in the fab before the end of 2002.
Earlier this month, AMD confirmed it was cutting the workforce in Fab 25 by 200 workers because flash memories required fewer process steps than microprocessors (see May 9 story). AMD processor production has been transferred to the company's Feb 30 in Dresden, Germany
"This capability, combined with MirrorBit technology AMD's multi-level cell architecture, can deliver the lowest manufacturing costs for flash memory devices in the industry," said Bertrand Cambou, group vice president for AMD's Memory Group. "The Austin fab is outfitted to carry us well into the future and is a strategic asset that will serve the needs of the large and growing wireless market."
Last week, AMD formally introduced its MirrorBit architecture technology to double the density of flash and compete with Intel Corp.'s two-bit-per cell Strataflash devices. AMD and its flash partner--Fujitsu Ltd. in Japan--claim the multi-level cell technology requires about one-third the number of process steps as Intel's floating-gate approach and will be lower cost than Strataflash devices (see May 13 story).