SANTA CLARA, Calif. -- Silicon Quest International (SQI) Inc. here announced that it has begun offering a backgrinding and wafer thinning service for semiconductor device manufacturers.
SQI's high-volume backgrinding service is focused on the production of 3- to 8-inch wafer sizes. The company's service also includes solder and gold bumped wafer thinning, and tight tolerance silicon-on-insulator (SOI) wafer thinning.
The company provides a critical service. "We hear horror stories of misprocessed, broken and even lost wafers by other backgrinding facilities," says Martin P. Gruening, SQI's backgrinding services manager. "As device z-axis dimensions shrink, sustained and repeatable excellence from the backgrinding services provider is an absolute necessity for manufacturers," he said.
SQI specializes in very-thin backgrinding capabilities down to 100-m, with total thickness variations (TTV) to < 1-m. Its production capacity is over 1500 wafers per day, with a breakage rate of 0.1% or less.
Standard cycle time is 48 hours, but 24 hour and same day services are also available, according to the Santa Clara-based company. Founded in 1991, SQI also offers in-house wafer polishing, reclaiming and thermal oxide services.
The company has also implemented its "SQI Quality of Service Initiative," which will ensure maximum wafer strength, consistent uniformity, high yield and reduced cycle times at reasonable cost.