MOUNTAIN VIEW, Calif. -- The X Initiative--the consortium that is pushing the "X Architecture" diagonal interconnect design for photomasks--today said the group has produced the first mask for the 130-nm process node.
Member companies Cadence Design Systems, DuPont
Photomasks and Numerical Technologies have successfully produced the first photomask based on the technology.
The development will help accelerate the adoption
of the X Architecture as a production-worthy approach to the pervasive use of diagonal interconnect, which reduces total on-chip wiring by more than 20% and via count by more than 30%.
In an experiment, Numerical performed OPC using its iN-Tandem
OPC software on 130-nm X Architecture design data supplied by Cadence, and performed mask data preparation using Numerical's CATS software. DuPont Photomasks created the mask using the ALTA 4000 system from X Initiative member company Etec Systems, Inc., an Applied Materials Inc.