WILLOW GROVE, Pa.--Kulicke & Soffa Industries Inc. today announced that National Semiconductor Corp. has become the latest chip maker to license wafer-bumping technology for advanced IC packaging.
National Semiconductor of Santa Clara, Calif., plans to continue using wafer-bumping services at K&S's Flip Chip Technologies LLC joint venture in Phoenix, but it is also planning to install the company's Flex-on-Cap technology in its own plants. Wafer-bumping places contacts on ICs before substrates are cut into individual chips for final packaging steps.
The Phoenix plant is ramping into high-volume production quicker than originally planned. Flip Chip Technologies' plant is now bumping about 5,000 wafers a week, which is about half of its planned capacity (see Jan. 26 story). In the past year Flip Chip Technologies has lined inked wafer-bumping licenses with Amkor Technology Inc., Advanced Semiconductor Engineering Inc., Siliconware Precision Industries Co. Ltd., and California Micro Devices Corp.
K&S officials in Willow Grove are hoping the joint venture's licensees will begin to ramp wafer-bumping production in their own facilities in the coming year so that the Phoenix plant will be able to dedicate more of its capacity to development.
"We are pleased that National Semiconductor has joined our growing list of licensees," said. "Our latest partnership with National is a continuation of FCT's strategy to accelerate mass market acceptance by leveraging our customers' production capabilities," said Joel Camarda, president of four-year-old Flip Chip Technologies in Phoenix.