SAN JOSE -- At the Intel Developer Forum, Intel Corp. here today (Feb. 28) expanded its efforts in the high-end, physical-layer chip market for local- and wide-area networking applications.
These new components are capable of receiving and transmitting data over multiple communications protocols, such as ATM, packet-over-SONET, packet-over-Fiber, and Ten Gigabit Ethernet.
"Our new optical products give our clients the ability to address the needs of service providers in the metropolitan, long-haul and ultra-long-haul sectors," said Mark Christensen, vice president and general manager of Intel's Network Communications Group.
Intel's new components include the IXF30005 and IXF30007, which are "digital wrapper" devices that encapsulate multi-protocol data in networks. The chips use a technology called forward error correction (FEC), which corrects errors that corrupt data packets as they travel over long distances, thereby increasing the distance that an optical signal can travel by up to 400%.
Also announced were a line of physical-layer components for ten-gigabits-per-second (OC-48) applications.
This includes the LXT16784/LXT16785--a multiplexer/demultiplexer chip set. Intel also rolled out the LXT16748/LXT16749--a multiplexer/demultiplexer chip set for ultra-long-haul applications.
The company also announced the LXT16742/LXT16743--a multiplexer/demultiplexer chip set for long-haul/metro applications. It also announced the LXT19908, which is a limiting amplifier.