EAST FISHKILL, N.Y. -- IBM Corp. today (March 26) announced a multi-project wafer program for its silicon-germanium process technology to help lower the cost of SiGe prototypes and small-volume products by placing more than one design on a wafer.
"By helping more companies and universities achieve easier access to the technology for prototype design, we intend to establish a solid base of current and future customers experienced with the IBM's SiGe technology," said Kenneth Torino, director of wireless products for IBM Microelectronics.
Under IBM's SiGe MPW initiative, customers share development and manufacturing expenses by submitting separate chip designs for fabrication on a single wafer substrate. IBM said designs for multi-project wafers will be placed on mask sets by the U.S.-based Mosis service organization and then fabricated at the company's Burlington, Vt., manufacturing facility.
"This program will enable Mosis customers to develop chips for high-performance, high-frequency applications such as wireless handsets," said Wes Hansford, deputy director of the Mosis Service unit in Marina del Rey, Calif. Twenty-year-old Mosis is a University of Southern California-centered prototyping and production service.