SANTA CLARA, Calif. -- ChipPac Inc. today announced an automated IC packaging design service that uses the company's Web site and addresses device performance and reliability issues. The design system addresses simulation and analysis of electrical, mechanical, and thermal characteristics.
"With operating frequencies common in the gigahertz range and ball pitches moving to 0.5-mm and less, today's customers have to be concerned both with device performance and the reliability of their end-product," said Marcos Karnezos, chief technology officer at ChipPac.
Customers input their package and performance requirements into the system over the company's Web site. Data is fed directly to ChipPac's engineering team for full design and characterization. The simulation and analysis system is applied to all of ChipPac's IC packaging families.
"This process allows us to better serve our customers by providing the most reliable package solutions with the fastest turn times possible," said Dennis McKenna, CEO and president of ChipPac.