DRESDEN, Germany--Nearly one year after starting construction on a 300-mm production facility here, Infineon Technologies AG today announced it is now ready to begin equipping the cleanroom for fabrication of 256-megabit DRAMs using next-generation processes with 0.14-micron design rules.
The Dresden production module will cost about 1.1 billion euros ($993 million) when it reaches full capacity by the end of 2002, said the Munich-based chip maker. While a handful of other chip companies are preparing to ramp production in pilot lines and small startup fabs, Infineon claims its Dresden facility is the world's first 300-mm (12-inch) wafer production plant.
"With the help of 300-mm production technology, Infineon aims to achieve significant cost savings per chip and considers the volume production of 300-mm chips as indispensable for the cost-effective manufacture of semiconductors," said Peter Kucher, vice president and managing director at the Infineon Technologies SC300 facility. "Compared with the conventional 200-mm technology used to date, it is now possible to fit approximately two-and-a-half as many chips onto the larger silicon wafers."
Infineon said the first products are expected to roll off the new 300-mm frontend line during the second half of 2001. In addition to 256-Mbit DRAMs, the company said it will introduce other products in the fab, but it did not release specific details about its 300-mm production roadmap.