EINDHOVEN, the Netherlands -- Philips Semiconductors here today announced a strategic partnership with the design services subsidiary of Cadence Design Systems Inc. to provide complete embedded solutions for wireless connections using Bluetooth radio-frequency links.
The design-services partnership for system manufacturers aimed at increasing the chances of first-time interoperability with other Bluetooth products, said Philips and Cadence's Tality Corp. subsidiary in San Jose. First-time design success will increase the profitability of new Bluetooth products, noted the partners.
The chip division of Royal Philips Electronics N.V. claims to be the only semiconductor supplier to sell more than one million Bluetooth baseband ICs. "This partnership will help our customers bring Bluetooth products to market rapidly and at low risk," said Gerhard Heider, manager of connectivity products at Philips Semiconductors.
Under the partnership, Tality will supply Bluetooth reference modules that use baseband and RF integrated circuits from Philips. The Cadence design subsidiary company will also include its own protocol stack and application profile software with the reference design platforms. The first modules--measuring 21-by-15-mm--will be made available to Bluetooth customers within the next month.
"Tality has accumulated design expertise in over 30 Bluetooth system and chip designs, has a proven protocol stack, a full suite of application profiles, and has frequently demonstrated Bluetooth system interoperability," said Simon Jones, general manager of Tality's Bluetooth Business Group.