NEWPORT, Wales --Trikon Technologies Inc. today announced a new series low-k dielectric materials for chemical vapor deposition (CVD) of insulating layers in copper dual damascene interconnect processes at the 0.90-nm (0.09-micron) technology node.
Trikon said the new Orion series is an organosilicate material, providing k values between 2.8 and less than 2.0. The company said the new copper interconnect dielectric process complements its Low K Flowfill material currently used in production for aluminum gap-fill metalization.
"Trikon now offers advanced semiconductor makers a low risk CVD route to dielectric materials from k=2.8 to sub 2.0," said Nigel Wheeler, president and chief executive officer of Trikon. The CEO said, "CVD dielectric deposition processes are widely considered preferable to competing spin-on technologies, as they require fewer process steps and smaller clean room footprint whilst giving faster batch cycles times and lower per-wafer costs."
However, Wheeler noted that some industry experts have suggested that it would be difficult to achieve ultra-low k values using CVD dielectric layers compared to spin-on films. A study last week suggested that porous spin-on dielectrics would gain an advantage at the 100-nm technology node (see May 24 story).
But Wheeler said Trikon was the first to sell equipment for commercial production of dielectrics with k values below 3.0 for aluminum interconnects. "With Orion we are now offering an ultra-low k for copper damascene processes," he said. "We have met our goal and achieved the low k values of the best spin-on processes with a CVD material that integrates with existing etch, strip and CMP equipment sets, offering significant advantages to our customers."
Trikon has worked with industry partners for 18 months to develop its Orion series of low-k CVD films for copper interconnects, said Andy Noakes, product marketing manager for chemical vapor deposition. "This family includes etch-stop and barrier layers as well as progressively lower k values for the main dielectric material," he said. Noakes said Trikon has developed "novel techniques enabling a low-density material that is also strong and resistant to post processing challenges."
The Orion low-k materials are available on Trikon's 300-mm production platform. Details on the Orion processes will be presented during the Semicon West trade show in San Francisco during July 16.