MARLBOROUGH, Mass. -- Shipley Co. L.L.C. today entered the spin-on dielectric market for next-generation interconnects on ICs with the launch of a new porous material, called Zirkon LK. The porous film can be applied with standard dielectric spin-coating tools for k values between 2.6 and 2.0, according to the company.
The technology incorporates nanometer-sized polymeric spheres with ultra-low metal-ion features, Shipley said. According to the company, simple thermal processing leaves "nanoscopic" air-filled spaces--what Shipley calls "Aircell dielectric films."
Fully cured Zirkon dielectric film can be produced without complex processes or hazardous ammonia treatments, said Shipley. The process forms precisely defined levels of uniformly distributed and unconnected Aircell porosity, resulting in a film permittivity (k value) from 2.6 to below 2.0 on standard spin coating equipment, Shipley said.
The company said it has engineered the Nanogen polymer within Zirkon LK dielectrics to control the pore size during the process steps. The pore sizes of less than 5 nm have been demonstrated. This is less than 1/20th the size of current interconnect structures, according to Shipley.
"The Zirkon dielectric materials have exceeded our original design expectations," said Eric Alling, business director for low-k products at Shipley.