MILPITAS, Calif. -- LSI Logic Corp. here today unveiled its third-generation of organic flip-chip packages, called flxI/O, which uses an area array approach for signal I/O placement to optimize die size and increase the number of input/output contacts, according to the company.
The flxI/O packaging technology is designed to allow signal I/O placement anywhere on the die, said LSI Logic. The new package technology gives designers the flexibility to reduce the die size by up to 60% or increase signal I/O density up to 65%, said the Milpitas company, which targeting the flxI/O at complex ASICs and system-on-chip ICs.
LSI Logic said the new flip-chip series is ideally suited for communication applications requiring data interfaces at rates of 5 gigabits per second or above.
The flxI/O packaging technology uses an organic substrate material similar to that used in LSI Logic's FPBGA series. The company said organic substrate technology offers greater signal density and improved electrical performance compared to ceramic substrates.
Furthermore, said the company, the use of an organic substrate enhances solder ball interconnect reliability as the coefficient of thermal expansion between the package and the printed-circuit board are closely matched. LSI Logic said this consideration is especially important when package sizes increase beyond 35 mm on a side.
"Communications devices are demanding greater signal density and performance," said Stan Mihelcic, manager of advanced packaging solutions at LSI Logic. He added, "flxI/O flip-chip package technology is better than wire bond or ceramic packages in meeting the high- performance needs of advanced chip designs."
Standard flxI/O packages are available immediately in high volumes to LSI Logic customers in body sizes from 31-mm to 50-mm-per-side, with ball counts from 896 to 2,397.