HOUSTON -- Targeting next-generation digital cable services, Texas Instruments Inc. here today announced a new chip offering based on advanced Time Division Multiple Access (TDMA) technology, which TI said enables a 50% increase in upstream capacity in networks.
TI said two integrated circuits--a new dual-channel receiver for the "headend" of cable networks and a recently certified chip for customer premise equipment--will work together to enable three times the upstream bandwidth per channel. The product offering also includes TI's patented INCA (increased capacity ingress cancellation) technology.
According to TI, the combination of its ICs and the INCA technology will allow multiple service operators to offer symmetric services over digital cable, including voice, multi-session videoconferencing, and peer-to-peer networking.
The new offering is aimed at addressing what TI said is a great disparity between the capacities of upstream and downstream bandwidths in today's cable networks. Currently, cable network downloads operate at 30-to-40 megabits per second while uploads run at only at 5-to-10 Mbits/sec., noted the company. TI said this disparity is acceptable when cable modems are primarily used for high-speed data delivery, but the emergence of new two-way applications is requiring symmetrical capacity.
TI said its new offering increases the upload capacity to 30 Mbits per second.
According to TI, advanced TDMA is an evolution of the data-over-cable-service-interface-specification (DOCSIS), optimized for symmetric services. The company said its advanced TDMA is fully compatible with DOCSIS and operates at the same RF channel.
TI's new TNETC4522 is a dual-channel burst receiver, incorporating INCA technology. The INCA technology enables equipment in cable plants to cancel ingress and burst noise, allowing multiple service operators to provide a cable modem network without an immediate network upgrade, said TI. In a "clean plant," INCA enables an increase in upstream capacity by allowing DOCSIS cable modems to transmit on overlapping frequencies without degradation in performance.
Samples of the new receiver chip and TI's TNETC4042 integrated MAC/PHY (physical layer) device for customer premise equipment are now available. Production quantities will be available in the third quarter of 2001, said TI.