ERFURT, Germany--X-Fab Semiconductor Foundries here today announced its has moved into the silicon-on-insulator wafer processing business, offering SOI technology for high-voltage and high-temperature chip applications.
The Germany foundry company said its SOI technology is a 1.0-micron process based on a dielectric-isolated, twin-well architecture. The process, fully developed by X-Fab, includes single-poly and three-metal layers. It has been qualified for operating temperatures up to 225 degrees C, said the company.
X-Fab is also offering design help in applying the SOI processes to new semiconductor products. A special design kit for the Affirma Spectre mixed-signal design environment from Cadence Design Systems Inc is being offered for support of SOI-based devices. X-Fab claims it is the first to offer such design support for mixed-signal, high-voltage ICs based on SOI technology.
"In the past, the utilization of SOI processes was limited due to a lack of design technologies and design kits," said Jens Kosch, vice president technology development & design support at X-Fab. "With the implementation of the new design kit, this unsatisfactory situation will be changed," he promised. "The design kit will open the door for designers to have easier access to the extraordinary features of SOI."
X-Fab said the new SOI design kit includes a standard cell library, specific high-voltage transistors for 30-, 60- and 90-volt implementations with high-precision BSIM3 simulation models and a variety of passive circuit elements. Also in development are I/O libraries, SRAM memory blocks and hall sensors for magnetic field detection, said the Germany foundry company.
The SOI process technology and design kits are now fully qualified and available for engineering and production purposes, said X-Fab. To start off the SOI foundry services, the company is planning to offer multi-project wafers--suitable for prototyping and low-volume production runs--at the start of November.