DANVERS, Mass.--Ibis Technology Corp. here today said it has secured financing for $4.5 million to lease additional production equipment for its initial 300-mm wafer line, which will produce silicon-on-insulator substrates using SIMOX-SOI technology.
Most of the 300-mm equipment will be used with the new Ibis 2000 oxygen implanter, which will be ready for production later this year, said Martin J. Reid, president and chief executive officer of the Danvers-based company. Ibis's SOI wafers are produced with separation by implantation of oxygen, known as SIMOX.
Financing for equipment leases is coming from Heller Financial Inc. of Chicago.
"Having the complete tool set for not only implanting, but annealing and characterizing wafers is a major competitive advantage for us," Reid said.
Ibis, like most other semiconductor equipment and materials vendors, is struggling with losses in the industry's sharp downturn. The supplier of SOI wafers and implanters reported a 61% sequential drop in revenues to $1.3 million in the second quarter and a net loss of $3 million in the period.