OTTAWA -- Hong Kong-based ASAT Holdings Ltd. today announced it will supply leadless plastic chip-carrier (LPCC) packages to SiGe Semiconductor Inc. here for Class 1 Bluetooth power amplifiers. The 3-by-1.6-mm form factor is the industry's smallest size for a fully encapsulated Class 1 Bluetooth power amplifiers, said the two companies.
ASAT said its Moisture Sensitive Level One (MSL-1) LPCC package eases manufacturing steps while delivering greater performance in high-speed wireless and portable system applications compared to other packaging technologies.
Canada's SiGe Semiconductor rolled out the PA2423L power amplifier in June, and the fabless chip supplier said over 25 customers have evaluated the device for Bluetooth-enabled laptops, personal computers, printers and consumer electronics. Some of these systems are scheduled to be shipped by the end of this year.
ASAT said its LPCC technology provides MSL-1 class protection, which eliminates the need for dry storage or baking of packages after exposure to air.
The PA2423L provides +22.5 dBm output power with 45% power-added efficiency when operated in class AB mode, and consumes only 80 milliamps for +20dBm output power. SiGe Semiconductor said it has integrated patent-pending output power control and ramping circuitry to eliminate requirements for external control ICs, saving the associated board space, cost, and power consumption.
In quantities of 10,000, the Bluetooth power amplifier costs $1.23 each. Samples are available today.