KIRCHHEIM-NABERN, Germany--Dialog Semiconductor GmbH here today announced a development pact with Japan's top mobile telephone carrier, NTT DoCoMo, to create integrated high-voltage and analog circuits for complex ICs used in future third-generation (3G) handsets.
The German supplier of mixed-signal CMOS circuits said higher levels of chip integration will enable the Japanese carrier to offer new 3G cellular phones at lower cost but with more functions for data and video services. Dialog said it has developed the capability to integrate high voltage and analog structures with complex digital IC using standard CMOS processes.
After delaying the launch of the world's first 3G network in May, NTT DoCoMo is now preparing to start its third-generation cellular phone service on Oct. 1. The 3G service, called FOMA (for Freedom Of Mobile multimedia Access), will enable users to download data at up to 384 kilobits per second and upload at 64-Kbits/sec speeds.
Dialog Semiconductor said it now has six experienced development engineers in central Tokyo working with customers in Japan. The new development agreement with DoCoMo's R&D unit was reached after a series of high-level executive meetings between the two companies, said Dialog Semiconductor.
DoCoMo claims to have 36 million subscribers in Japan. The company currently offers Internet access to users of mobile phones in its i-mode handset. DoCoMo has refused to disclose the target price for 3G handsets in October, but reports have indicated that the phones will most likely cost twice as much as the company's Internet-linking units, which sell for about $500.