GENEVA--STMicroelectronics here today announced a development agreement with China's Huawei Technologies Co. Ltd. to create a new integrated power and network-processing IC for telephone line cards in switching office equipment.
The integrated circuit will be fabricated with STMicroelectroncs' third-generation bipolar-CMOS-DMOS (BCD) process, enabling the integration of processing functions and high-power circuits, according to the company. The new chip will reduce power dissipation in telephone line interface cards and increase the number of lines possible in equipment, said the European chip maker.
The new BCD-based circuit will be used by Huawei to produce central office systems for China's telecom market. In China, demand for telephone lines is surging and adding at least 30 million new lines per year, according to STMicroelectronics. The volume demand for the new IC being developed with Huawei could reach 20 million lines per year, said the company.
Samples of the new IC are expected to be available by the end of this month with volume production planned for 2002, ST said.
"ST is already a supplier of standard components to Huawei Technologies," said Pietro Palella, group vice president and general manager of the company's Wireline Communications Division. However, this project is the first time ST has been awarded a major development contract from Huawei, he added.
A revenue value on the contract and potential volume shipments was not released.