SANTA CLARA, Calif. -- Applied Materials Inc. today notified the chip industry that it has secured two more U.S. patents for low-k dielectric film technology, based on chemical vapor deposition (CVD).
The world's largest supplier of wafer fab equipment said it now has more than 15 patents related to CVD-based low-k deposition technology, which the company believes will be necessary to increase the speed and performance of ICs in the 0.13-to-0.10-micron process generations.
"These new patents cover some of our most important intellectual property regarding low-k dielectric films," said Farhad Moghadam, vice president and general manager of Applied Materials' Dielectric Systems and Modules Product Business Group. "They protect our Black Diamond technology and demonstrate our leadership in providing customers with innovations to meet their next-generation chip design requirements."
Applied said it was granted patents No. 6,287,990 and. 6,303,523 in September and October. Both patents are centered on the Black Diamond low-k technology, which is a family of organosilicate glass-based dielectric products introduced three years ago by the Santa Clara company. According to Applied, 17 chip makers are working on processed using Black Diamond, with the first wave aimed at 0.13-to-0.10-micron processes.
Black Diamond low-k dielectric films have demonstrated the ability to be used in every level of an eight-layer copper IC, according to Applied, which said customers are expecting to ship chips that integrate the technology into devices in 2002.