SANTA BARBARA, Calif. -- Innovative Micro Technology here this week announced an expansion of its microelectromechanical systems (MEMS) fab and assembly/packaging facility. The MEMS frontend fab now has 30,000 square feet of class 100 production area, while the backend packaging section totals 4,000 square feet, according to the company.
"To our knowledge, ours is the largest pure MEMS fab of any independent MEMS manufacturer," said Monte Heaton, vice president of marketing and sales at Innovative Micro Technology (IMT). "When you include the chase, maintenance and assembly and packaging areas, IMT's fab is well over 40,000 square feet."
IMT said its production fab provides +/-1 degree F temperature control and +/-3% relative humidity control. Added to the fab as part of the expansion is wafer bonding (anodic, eutectic, Si fusion, glass frit and other processing steps). The bonding processes and systems will handle up to three wafers, allowing IMT to build more complex structures and devices, such as microfluidic systems, according to company officials.
The facility also contains lithography systems for 0.35-micron feature sizes, deep reactive ion etch for high-aspect ratio structures (up to 10:1), and a suite of metal and dielectric deposition/etch, including magnetic materials. The company said it is also offering wafer- and die-level device test and metrology as well as reliability testing capabilities for MEMS products.
IMT said it was actively looking for partners in MEMS manufacturing. The company did not release information on the amount of investment made in its expanded facilities.